FAIRS



INTERMOLD / DIE AND MOLD ASIA / JAPAN METAL STAMPING TECHNOLOGY EXHIBITION

Data:
4/17/2024 - 4/19/2024
Osaka (changing) -Japan

Location:
INTEX Osaka International Exhibition Center
http://www.intermold.jp/english/

Last Event:
Visitors:80000
Exhibitors:290
Frequency:twice a year
Admittance type:traders only

Organiser:
I.T.P.
1-1-25, Kita-horie, Nishiku
JPN-550-0014 Osaka
infoim@itp.gr.jp
None

Get to know the exhibitors.

SATSUMA PRECISION CO.,LTD
Daito-city, Osaka
Japan

SANWA PACKING INDUSTRY CO. LTD
Osaka
Japan

SANSEIKI CO., LTD
HAGI-CTIY, YAMAGUCHI
Japan

SANKYORIKAGAKU CO.,LTD
Okegawa City, Saitama Pref.
Japan

SANKI SEIKO CO., LTD.
Ashikaga-City
Japan

257,208

Fairs


SITEVINITECH ARGENTINA formerly SITEVI MERCOSUR


International trade show of grape, fruit-tree growing and wine-making equipment

TIBCO incorporating PROSHOP & EXPO SERVICES


International consumer goods fair